Glosario de PCBs

El libre acceso a la información es un derecho de todos


Activation/ Soak Zone (PCBA)

Active Component

Additive Process (PCB)

AFI (Final Inspection)

Annular Ring

Anti-Pad

AOI

AOI Assembly Inspection

AOI Bare Inspection

Aperture (Gerber File)

Aperture (Soldermask)

Aperture (Stencil)

Aperture List / Aperture Table

Artwork

ASCII

ASIC (IC)

Aspect Ratio

Assembly

Assembly Drawing

ATE

Auto-Router

Automatic Registration (PCB)

AWG

B-Stage (Pre-Preg)

Back Drilling (PCB)

Backplane (PCB)

Bare Board

Barrel (PCB)

Base Laminate

Bed of Nails (PCBAs)

Bevel (PCB)

BGA (Ball Grid Array)

BGA Solder Column

Blind Via

Blow Hole (Solder)

Board

Body

BOM (Bill of Materials)

Bond Strength (PCB)

Bow (PCB)

Breakdown Voltaje (PCB)

Breakout Board (BoB PCB)

Bridge (Solder)

Buried Via

Burr (PCB)

C-Stage (Pre-Preg)

CAD

CAM

Capabilities (PCB / PCBA)

Capacitance (PCB)

Castellated Drills

CBGA

CCGA

CEM1

CEM3

Centroid File (Pick and Place)

Chamfer (PCB Edge)

Chamfered Routing

Chip on Board (COB)

Clearance

CNC (PCB / PCBA)

Cold Joint (PCBA)

Component

Component Type

Conductor to Hole Spacing

Conformal Coating (PCBA)

Conveyor

Cooling Zone (PCBA)

Copper Clad (PCB)

Copper Foil (PCB)

Copper Pour (PCB)

Copper Thieving (PCB)

Copper Weight (PCB)

Copper Width (PCB)

Core (MLB PCB)

Counter Sink Hole (PCB)

Counterbore Hole (PCB)

Courtyard

Cover-Lay (PCB)

CPCB (Ceramic PCB)

Crosshatching (PCB)

CTE (PCB)

Curing (Soldermask/ Silkscreen)

Current Carry Capacity (PCB)

Cut Layer

Cut Tape (Components)

D-Code

Dam (Soldermask)

Deburring (PCB)

Delamination (PCB)

Dentritic Growth (PCBA)

Depaneling (PCB)

Design Rule (PCB)

Desmearing (PCB)

Developing (PCB)

Device level ESD

DFA (PCB)

DFM

DFN (SMD Package)

DFT (PCB)

Die (Integrated Circuit)

Dielectric (PCB)

Differential Pair (PCB)

Digi-Reel (Components)

Dimensional Stability

Dispenser (PCBA)

Dk ó Er (Dielectric Constant)

Double Side PCB

DRC

Drill Bit (PCB)

Drill Drawing Layer (PCB)

Dry Film Photoresist

Dry Film Soldermask

Dry Joint (PCBA)

DUT

E-Test (Electrical Test)

Edge Board Connector

Edge Clearance

Edge Connector (PCB)

Electroless Plating

Embedded Component (PCB)

EMC

EMI (Electromagnetic Interference)

Encapsulating Resin

Enclosure (PCBA)

ENEPIG (Surface Finish)

ENIG (Surface Finish)

Entry Board (PCB)

EPA (Antistatic)

ESD

ESD Floor Mat (Antistatic)

ESD Heel Grounder (Antistatic)

ESD Work Surface (Antistatic)

ESD Wrist (Antistatic)

Etch Factor (PCB)

Etchback (Multilayer PCB)

Etching

Exellon

Exposed-Pad

External Routing (PCB)

Feeder (Assembly)

Fiducials

Fillet (Solder)

Fine Line and Spaces (PCB)

Fine Pitch

Fixture (PCBA)

Flip Chip

Floor Life

Flux (Solder)

Flux Zone (PCBA)

Flying Probe

Footprint

FPC (Flexible PCB)

FR2

FR3

FR4

FR5

Gerber File

Gerber File Viewer

Gerber RS-274D

Gerber RS-274X

Gerber X2

Gold – Hard Gold

Gold Finger (PCB)

Golden Board (PCB)

Grid

Ground Plane (PCB)

Gull Wing Lead (Component)

HASL

HASL Lead-Free

HDI PCB

Head in Pillow (Solder Defect)

Heavy Copper (PCB)

High Speed PCB

Hole Activation (PCB)

Hole Breakout (PCB)

Hot Pencil (PCBA)

ICT (In-Circuit Test)

ImAg (Surface Finish)

Imaging (PCB)

Impedance (PCB)

Impedance Control (PCB)

ImSn (Surface Finish)

Inner Layer

Inner Layer Polarity (PCB)

Intermetallics (Solder)

Internal Routing (PCB)

IPC

IPC Class I

IPC Class II

IPC Class III

IPC-A-610

Islands (PCB)

Isolation Routing (PCB)

J-Lead (Component)

JEDEC

Jumper Wire

Keying Slot (PCB)

Laminating Press (Multilayer)

Land Pattern

Lay-Up (Multilayer)

Layer (PCB)

Layer Registration (PCB)

Layer to Layer Spacing (PCB)

LDI

LDS Process (PCB)

Lead (Component)

Lead Free PCB

LGA (Land Grid Array)

LPI Solder Mask

MCPCB

Mechanical Layer (PCB)

MEM S (Components)

Micro BGA (Component)

Micro-Sectioning

Microstrip (PCB)

Microvia

Mil / Thou (PCB)

MLB (Multilayer PCB)

MLB Lamination (Multilayer PCB)

Mounting Hole

MSL (SMD Components)

MSOP (Component)

NC-Drill File

Negative Image

Net

Netlist

Nick (PCB)

No Clean Flux (Solder)

Non Wetting / Dewetting (Solder defect)

Notch

NPTH

NSMD (Non Solder Mask Defined)

ODB++

Open (PCB)

OSP (Surface finish)

Outer Layer (PCB)

Outgassing (PCB)

Over-Etch (PCB)

OZ (Ounce)

Package

Pads

Panel (PCB)

Panel (PCBA)

Panel Plating (PCB)

Passive Component

Paste Stencil (PCBA)

Pattern (PCB)

Pattern Plating (PCB)

PCB

PCB Cavity

PCB CNC Cut

PCB Design

PCB Drilling

PCB Exposure

PCB Lamination (Photoresist)

PCB Milling

PCB Prototype

PCBA

PDIP

PDN (Design)

Peel Strength (PCB)

Peel-off Mask

Permitivity (PCB)

Photo Mask (PCB)

Photoploter

Pick and Place (PCBA)

Pin Header

Pin Hole (PCB)

Pin-In-Paste

Pin-Out

Pitch

Pitting (PCB)

Plane (PCB)

Plating (PCB)

Plating Void Hole

Polarity (Component)

Polygon (PCB)

Polyimide (Substrate)

Polymerize (PCB)

Populated (PCBA)

Positive Image

Potting (PCBA)

Power Plane (PCB)

Pre-Preg

Pre-Preg Thickness (PCB)

Preforming (Components)

Preheat Zone (PCBA)

Press-Fit

Primitive

Printed Electronics

Protoboard / Breadboard

Protrusion (PCB)

PTFE (PCB)

PTH

Pulse Plating (PCB)

QFN (Quad Flat No-Leads)

Ratsnest

Reballing (BGA)

Reference Designator

Reflow

Reflow Oven

Reflow Soldering (PCBA)

Reflow Zone (PCBA)

Resin Smear

Rework (PCBA)

RF PCB

Rigid PCB

Rigid-Flex PCB

RoHS

RoHS Compliant PCB

Rosin Flux (Solder)

Routers (PCB)

Routing

RX Inspection

SAC Solder

SAC305

Schematic

Selective Soldering (PCBA)

Serpentine Trace (PCB)

Shadowing (PCB)

Short (PCB)

Signal (PCB)

Signal Integrity (PCB)

Silkscreen

Single Side PCB

Slot (PCB)

SMD (Solder Mask Defined)

SMD Adapter

SMD Adhesive (PCBA)

SMD Chip Component

SMD Component

SMD Component TAB

SMD Pad

SMT (Surface Mount Technology)

SMT Laser Stencil

SOIC/ SO/ SOP (Component)

Solder Ball

Solder Leveling

Solder Mask Expansion

Solder Paste

Solder Paste Deposit

Solder Paste Printing

Solder Resist (PCB)

Solder Side / BOTTOM Side (PCB)

Solder Voids (Exposed pad)

Solderability (PCB)

Soldermask

SON (SMD Package)

Spacers

SPI (3D Solder Paste Inspection)

Squeegee

SSOP (Component)

Stacked Vias (PCB)

Stackup

Staggered Vias (PCB)

Standoffs

Stencil Thickness (PCBA)

Step and Repeat

Stripline (PCB)

Stripping

Substractive Process (PCB)

Substrate

Surface Finish

System Level ESD

TAB (Tape-Automated Bonding)

Tab Routing

Tape and Reel (Components)

Td (PCB)

TDR

Teardrops

Test Coupon (PCB)

Test Pad (PCB)

Test Probe (PCBA)

Tg (PCB)

Thermal Conductivity (PCB)

Thermal Pad (PCB)

Thermal Profile

Thermal Profiler (PCBA)

Thermal Relief Pad

Thermal Resistance (PCB)

Thermal Stress / Fatigue

Thermal Vias

Thickness (PCB)

Through Hole Technology (THT)

Tombstone

Tooling (PCB)

Tooling Holes (PCB)

Top Side / Component Side (PCB)

Trace

Tray (Components)

TSOP (Component)

Tube/ Rail (Components)

Twist (PCB)

UL (Underwriters Laboratories)

Undercut (PCB)

Underfill

Underwriters Symbol (PCB)

V-Scoring

Vacuum Package

VDD / VCC

Via (PCB)

Via Encroached

Via Filled

Via in Pad

Via Plugged

Via Stitching

Via Stub (PCB)

Via Tenting

VSS / VEE

Wafer

Wave Soldering (PCBA)

Wearable Electronics

Wetting (Solder)

Wicking (PCB)

Wire Bonding

WS Flux (Solder)