Glosario de PCBs

Access Hole (PCB)

Activation/ Soak Zone (PCBA)

Active Component

Additive Process (PCB)

Adjacency Test

AFI (Final Inspection)

Analog Circuit

Anchoring Spur (Flexible PCB)

Annular Ring

Anti-Pad

AOI

AOI Assembly Inspection

AOI Bare Inspection

Aperture (Gerber File)

Aperture (Soldermask)

Aperture (Stencil)

Aperture List / Aperture Table

Array (PCB)

Artwork

ASCII

ASIC (IC)

Aspect Ratio

Assembly

Assembly Direction (PCBA)

Assembly Drawing

ATE

Auto-Router

Automatic Registration (PCB)

AWG

B-Stage (Pre-Preg)

Back Drilling (PCB)

Backplane (PCB)

Bare Board

Barrel (PCB)

Base Laminate

Bed of Nails (PCBAs)

Bevel (PCB)

BGA (Ball Grid Array)

BGA Solder Column

BGA Voiding X Ray

Blind Via

Blister (PCB)

Blow Hole (Solder)

Board

Board Outline

Board Shape

Body

BOM (Bill of Materials)

Bond Strength (PCB)

Bounding Surface (PCBA)

Bow (PCB)

Breakdown Voltaje (PCB)

Breakout Board (BoB PCB)

Bridge (Solder)

Buried Via

Burr (PCB)

C-Stage (Pre-Preg)

CAD

CAM

CAM File

Capabilities (PCB / PCBA)

Capacitance (PCB)

Castellated Drills

CBGA

CCGA

CEM1

CEM3

Center to Center Spacing

Centroid File (Pick and Place)

Chamfer (PCB Edge)

Chamfered Routing

Check Plots

Chip on Board (COB)

Chip Scale Package (CSP)

Clearance

Clearance Hole

CNC (PCB / PCBA)

Cold Joint (PCBA)

Component

Component Coordinate

Component Type

Conductor Spacing (PCB)

Conductor to Hole Spacing

Conectivity

Conformal Coating (PCBA)

Continuity (PCB)

Continuity Test (PCB)

Conveyor

Cooling Zone (PCBA)

Copper Clad Laminate

Copper Foil (PCB)

Copper Pillar Bump

Copper Pour (PCB)

Copper Thieving (PCB)

Copper Weight (PCB)

Copper Width (PCB)

Core (MLB PCB)

Core Thickness

Counter Sink Hole (PCB)

Counterbore Hole (PCB)

Courtyard

Cover-Lay (PCB)

CPCB (Ceramic PCB)

Creepage

Crosshatching (PCB)

CTE (PCB)

Curing (Soldermask/ Silkscreen)

Current Carry Capacity (PCB)

Cut Layer

Cut Line (PCB)

Cut Tape (Components)

D-Code

Dam / Web (Soldermask)

Data Sheet (Component)

Date Code (PCB)

Datum (PCB)

Dead Copper (PCB)

Deburring (PCB)

Delamination (PCB)

Dentritic Growth (PCBA)

Depaneling (PCB)

Design Rule (PCB)

Desmearing (PCB)

Developing (PCB)

Device level ESD

DFA (PCB)

DFM

DFN (SMD Package)

DFT (PCB)

Die/ Chip (Integrated Circuit)

Dielectric (PCB)

Differential Pair (PCB)

Digi-Reel (Components)

Digital Circuit

Dimensional Stability

Direct Printing (Rework)

Dispenser (PCBA)

Dk ó Er (Dielectric Constant)

Double Side Assembly

Double Side PCB

DRC

Drill Bit (PCB)

Drill Drawing Layer (PCB)

Dry Film Photoresist

Dry Film Soldermask

Dry Joint (PCBA)

DUT

E-Pad (PCB)

E-Test (Electrical Test)

Edge Clearance

Edge Connector (PCB)

Electroless Plating

Electromechanical Component

Embedded Component (PCB)

EMC

EMI (Electromagnetic Interference)

Encapsulating Resin

Enclosure (PCBA)

End Mill (PCB)

ENEPIG (Surface Finish)

ENIG (Surface Finish)

Entry Board (PCB)

EPA (Antistatic)

ESD

ESD Floor Mat (Antistatic)

ESD Heel Grounder (Antistatic)

ESD Work Surface (Antistatic)

ESD Wrist (Antistatic)

Etch Factor (PCB)

Etchback (Multilayer PCB)

Etching

Exellon Format

Exposed-Pad

External Routing (PCB)

Feeder (Assembly)

Fiducials

Fillet (Solder)

Fine Line and Spaces (PCB)

Fine Pitch

Fixture (PCBA)

Flatness (PCB)

Flip Chip

Floor Life

Flux (Solder)

Flux Zone (PCBA)

Flying Probe

Footprint

FPC (Flexible PCB)

FR2

FR3

FR4

FR5

Full Stack Via

Gerber File

Gerber File Viewer

Gerber RS-274D

Gerber RS-274X

Gerber X2

Global Fiducials

Gold – Hard Gold

Gold Finger (PCB)

Golden Board (PCB)

Grid

Ground Plane (PCB)

Grounded Mounting Hole (PCB)

Gull Wing Lead (Component)

HASL

HASL Lead-Free

HDI PCB

Head in Pillow (Solder Defect)

Heavy Copper (PCB)

High Speed PCB

Hole Activation (PCB)

Hole Breakout (PCB)

Hole tolerance (PCB)

Hot Air Pencil (PCBA)

ICT (In-Circuit Test)

ImAg (Surface Finish)

Imaging (PCB)

Impedance (PCB)

Impedance Control (PCB)

Imperial

ImSn (Surface Finish)

Inmerssion Plating (PCB)

Inner Layer

Inner Layer Polarity (PCB)

Interconnect Stress Test (IST)

Intermetallics (Solder)

Internal Ground Plane (PCB)

Internal Power Plane (PCB)

Internal Routing (PCB)

Internal Signal Layer (PCB)

Interposer

IPC

IPC Class I

IPC Class II

IPC Class III

IPC Inspection Guidelines (PCB)

IPC-A-610

Islands (PCB)

Isolation Routing (PCB)

J-Lead (Component)

JEDEC

Jump Scoring (PCB)

Jumper Wire

Keying Slot (PCB)

Laminating Press (Multilayer)

Land Pattern

Lay-Up (Multilayer)

Layer (PCB)

Layer Registration (PCB)

Layer Sequence (PCB)

Layer to Layer Spacing (PCB)

LDI

LDS Process (PCB)

Lead (Component)

Lead Frame Package

Lead Free PCB

Leakage Current

LGA (Land Grid Array)

Local Fiducials

LPI Solder Mask

Major Defect

Manufacturer Part Number (PCB)

MCPCB

Mechanical Layer (PCB)

MEM S (Components)

Metric

Micro BGA (Component)

Micro-Sectioning

Microstrip (PCB)

Microvia

Mil / Thou (PCB)

Minimun Traces and Spaces

Minor Defect

MLB (Multilayer PCB)

MLB Lamination (Multilayer PCB)

Mounting Hole

Mouse Bites (PCB)

MSL (SMD Components)

MSOP (Component)

NC-Drill File

Negative Image

Net

Netlist

Nick (PCB)

No Clean Flux (Solder)

Non Wetting / Dewetting (Solder defect)

Non-Supported Holes (PCB)

Notch

NPTH

NSMD (Non Solder Mask Defined)

ODB++

Open (PCB)

OSP (Surface finish)

Outer Layer (PCB)

Outgassing (PCB)

Over-Etch (PCB)

OZ (Ounce)

Package

Pads

Panel (PCB)

Panel (PCBA)

Panel Fiducials

Panel Plating (PCB)

Panel Rails (PCB)

Panelize

Passive Component

Paste Stencil (PCBA)

Pattern (PCB)

Pattern Plating (PCB)

PCB

PCB Cavity

PCB Antenna

PCB Assembly Process

PCB CNC Cut

PCB Design

PCB Drilling

PCB Exposure

PCB Fabrication Process

PCB Lamination (Photoresist)

PCB Manufacturing Process

PCB Milling

PCB Prototype

PCB Singulation

PCB Spark Gap

PCBA

PDIP

PDN (Design)

Peel Strength (PCB)

Peel-off Mask

Peeling (PCB)

Permitivity (PCB)

Phenolic PCB

Photo Mask (PCB)

Photoploter

Pick and Place (PCBA)

Pin

Pin Header

Pin Hole (PCB)

Pin-In-Paste

Pin-Out

Pitch

Pitting (PCB)

Plane (PCB)

Plating (PCB)

Plating Void Hole

PLCC

Polarity (Component)

Polygon (PCB)

Polyimide (Substrate)

Polymerize (PCB)

Populated (PCBA)

Positive Image

Potting (PCBA)

Pre-Preg

Pre-Preg Thickness (PCB)

Preforming (Components)

Preheat Zone (PCBA)

Press-Fit

Primitive

Printed Electronics

Protoboard / Breadboard

Protrusion (PCB)

PTFE (PCB)

PTH

Pulse Plating (PCB)

QFN (Quad Flat No-Leads)

QFN Voiding RX Inspection

QFP (Component)

Ratsnest

Readme File

Reballing (BGA)

Reference Designator

Reference Point (PCB)

Reference/ Part Number (PCB)

Reflow

Reflow Oven

Reflow Soldering (PCBA)

Reflow Zone (PCBA)

Resin Smear

Revision (PCB)

Rework (PCBA)

RF

RF PCB

Rigid PCB

Rigid-Flex PCB

Rogers Material (PCB)

RoHS

RoHS Compliant PCB

Rosin Flux (Solder)

Rotation Angle (Component)

Roughness (PCB)

Routers (PCB)

Routing

RX Inspection

SAC Solder

SAC305

Schematic

Screen Printing

Segmented Stencil Opening

Segmented Thermal Pad

Selective Soldering (PCBA)

Serpentine Trace (PCB)

Shadowing (PCB)

Shelf Life (Solder Paste)

Short (PCB)

Side / Edge Plating

Signal (PCB)

Signal Integrity (PCB)

Silkscreen

Single Side PCB

Skin Efect (PCB)

Sliver (Copper)

Sliver (Soldermask)

Slot (PCB)

Slump (Solder Paste)

SMD (Solder Mask Defined)

SMD Adapter

SMD Adhesive (PCBA)

SMD Chip Component

SMD Component

SMD Component TAB

SMD Pad

SMT (Surface Mount Technology)

SMT Antenna

SMT Laser Stencil

SOIC/ SO/ SOP (Component)

Solder Ball

Solder Bumps

Solder Coat

Solder Joint (PCBA)

Solder Leveling

Solder Mask Color (PCB)

Solder Mask Expansion

Solder Paste

Solder Paste Alloy

Solder Paste Deposit

Solder Paste Printing

Solder Paste Type

Solder Resist (PCB)

Solder Side / BOTTOM Side (PCB)

Solder Voids (Exposed pad)

Solder Wick

Solderability (PCB)

Soldermask

SON (SMD Package)

Spacers

SPI (3D Solder Paste Inspection)

Squeegee

SSOP (Component)

Stacked Vias (PCB)

Stackup

Staggered Vias (PCB)

Standoffs

Stencil Life (Solder Paste)

Stencil Thickness (PCBA)

Step and Repeat

Stripline (PCB)

Stripping

Substractive Process (PCB)

Substrate

Surface Finish

Surface Insulating Resistance (PCB)

System Level ESD

TAB (Tape-Automated Bonding)

Tab Routing

Tackiness (Solder Paste)

Taconic Material (PCB)

Tape and Reel (Components)

Td (PCB)

TDR

Teardrops

Tenting

Test Coupon (PCB)

Test Fixture

Test Pad (PCB)

Test Probe (PCBA)

Tg (PCB)

Thermal Conductivity (PCB)

Thermal Pad (PCB)

Thermal Profile

Thermal Profiler (PCBA)

Thermal Relief Pad

Thermal Resistance (PCB)

Thermal Stress / Fatigue

Thermal Vias

Thickness (PCB)

Through Hole Technology (THT)

THT Insertion Process

Tombstone

Tooling (PCB)

Tooling Holes (PCB)

Top Side / Component Side (PCB)

Trace

Tray (Components)

TSOP (Component)

Tube/ Rail (Components)

Twist (PCB)

UL (Underwriters Laboratories)

Undercut (PCB)

Underfill

Underwriters Symbol (PCB)

V-Scoring

Vacuum Package

VDD / VCC

Via (PCB)

Via Encroached

Via Filled

Via in Pad

Via Plugged

Via Stitching

Via Stub (PCB)

Via Tenting

VSS / VEE

Wafer

Wave Soldering (PCBA)

Wearable Electronics

Wetting (Solder)

Wicking (PCB)

Wire Bonding

Wire Wrap Area (PCB)

WS Flux (Solder)

X-Axis

X-Outs

Y-Axis

Z-Axis